PLP多功能複合式加熱設備 PLP Multi-Function Hybrid Heating Equipment
PLP多功能複合式加熱設備 PLP Multi-Function Hybrid Heating Equipment
加熱設備以Chamber為單位的模組化設計,依客製需求數量配搭,精準加熱,最高溫可達350℃。
結合熱傳導和紅外線加熱,實現基板均勻加熱,提高產品品質。
Featuring a modular, chamber-based design, the heating system can be flexibly configured to meet diverse customer requirements. With precise temperature control up to 350 °C, it delivers reliable and efficient thermal performance.
By integrating conductive and infrared heating technologies, the system ensures uniform substrate heating, improving process consistency and overall product quality.



















