TEEIA

自動化蒸鍍機載卸檢測設備

宏惠光電股份有限公司

成立於1987年,以代理為主導的光電、光學專業領域產品公司,開啟全方位專業的代理、行銷業務、研發、生產於各相關產業發展的服務,致力於光電、光學、半導體之精密元件及組件、生技檢測、各式量測設備的整合工程。


公司憑藉著:誠信、服務、迅速、準確的理念與國際光電廠商、客戶端創造多贏的長期合作關係,產品包含精密光電元件、光電檢測設備、雷射設備、光譜儀設備、光纖主動被動元件模組、光學鏡頭成像品質量測設備、半導體雷射清洗設備、半導體檢測整合設備等。

Solution Details

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E-Gun蒸鍍機與自動化載卸檢測晶圓設備結合下,在第三代半導體中的應用技術為高品質薄膜沉積、均勻性控制、減少污染和精實人力等方面具有提升市場的競爭力優勢。以下為設備功能及特點:

功能:

  • 針對 E-GUN 蒸鍍設備類之鍍鍋載具進行晶圓片作業:


  1. 晶圓尺寸4”, 6”, 8”, 訂製後為單一尺寸
  2. 取代人力提高鍍鍋晶圓片載、卸精準度
  3. 定位邊定位、校準放回
  4. OCR ID登錄 (QR code 為選配)
  5. 邊緣Chipping & Breakage 檢查 (Through type)
  6. CST Mapping 檢查是否誤置 (Double Stacked 疊片, Cross slotted)
  7. 上述工作之工作結果可經由SECS/GEM傳至MES,提供生產履歷 (客製化格式)

特點:
  • 運用3向量雷射,以毫秒級測定鍍盤平面,作可重複及高精度之載、卸,避免人工破片及誤放,以對應越來越薄且脆的wafer 製程。
  • 可紀錄Wafer ID放置之鍍盤工位及鍍鍋ID,生產Raw Data供生產大數據分析,去除良率盲點。
  • 特有之鍍盤固定方式,兼顧自動化及可靠度,取代舊有鍍盤拉簧式結構,所造成每盤壓力不均勻的問題。
  • 使用6軸手臂的多工作平面特性,精準達到鍍鍋3D不同平面且高重複性的載、卸作業。
  • Mapping使用小光點Laser Sensor 搭配特有算法,可穩定偵測出厚度0.2以上晶圓片。
  • 全機使用多孔式Peek吸盤,(與FOUP等CST同材質),減少汙染及損傷。
  • SECS/GEM為自主開發軟體,專為12"_300mm晶圓設備自動化量身定制,不受市售軟體供應商限制開發格式。
  • SECS/GEM具有單機版與 API 版並行,支援兼容NET Core/NET 6 以上版本,高效的PLC系統兼容,提供設備間高效的數據通信與控制,確保靈活及穩定運行最佳選擇。

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