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半導體相關解決方案

翔名科技股份有限公司

翔名科技 (Feedback Technology) 是全球半導體前段設備耗材領域的重要企業,專精於鎢、鉬、鉭、石墨等特殊金屬的精密加工,產品應用於離子植入設備的關鍵零組件。公司技術範疇擴展至半導體薄膜製程、黃光製程及蝕刻製程等先進製程設備,持續發展自有技術,完成半導體製程耗材中的垂直整合。翔名科技通過ISO系統稽核,並獲得數家國際設備大廠認證,與半導體產業的領導企業有超過二十年的合作關係,深受客戶信賴。

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半導體相關解決方案

(1) 微奈米級功能塗層技術
熱噴塗、高壓冷噴塗等微米級塗層技術已廣泛應用在抗電漿、抗腐蝕、高絕緣、隔熱層及耐磨耗塗層使用。翔名科技在此方案取得許多材料鍍膜專利,並已應用於本地先進大廠的先進製程設備零件上,不僅污染微粒數量減少了90%,亦解決了電漿腐蝕,使膜層剝落的問題。
(2) 高深寬比鍍層技術
原子層沉積(ALD)、電漿化學氣相沉積(PECVD)、化學浸鍍等技術生長厚度幾百奈米之單晶鍍層,且此工法不被幾何形狀受限,可針對微孔或PIN等立體結構沉積均勻且緻密的薄膜。搭配熱處理退火可使單晶層製密化、不易剝落,且同時消除基材應力產生,增加鍍層物理及化學穩定性。
(3) 石墨抗微粒技術
現今先進製程對腔體潔淨度管控非常嚴格,可說是掌控汙染源就掌控良率,因此離子佈植機的離子源周邊的石墨元件是第一個可能的汙染源。翔名科技的石墨抗微粒技術可以極快有效降低石墨汙染源,免除人工清洗及殘留廢液的額外處理成本,也符合ESG的精神。
(4) 電子束焊接技術
電子束焊接技術廣泛應用於半導體設備腔體製造及其他領域,有能大幅降低了焊道氧化及其他污染,具有高潔淨度及高焊接強度之優勢。除此之外,電子束焊接具有高穿透性及低熱影響區,常用於對接、T形接、搭接等型式焊接,尤其適用於接頭受結構限制的特殊場合。我們具有最先進的設備與技術,可精密控制電子束及其擺盪,進行複雜及精準的焊接,大尺寸真空腔體可容納超過1公尺長度的工件,可應用於大部分金屬,並可進行異質材料焊接。
(5) 第三代半導體材料加工技術
翔名科技開發第三代半導體材料加工技術,導入飛秒等級以上之超快速雷射加工技術,以因應未來客戶特材加工處理需求。
(6) E-Chuck清洗修復技術
在半導體設備中,E-Chuck在使用上會面臨異常下機的問題,翔名科技的新型技術可以進行E-Chuck表面修復,大幅降低客戶成本及交期。

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