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  • Description

  • Company Basic Information

  • Company Description

    LINCOTEC, founded in 1999, specializes in thin-film sputtering (PVD) and plasma etching equipment, with over two decades of expertise in advanced thin-film RDL and dry process technologies.

    LINCOTEC is a leading provider of SiP EMI shielding sputtering equipment and a key contributor to the global SiP supply chain for major mobile device manufacturers. Its solutions are widely adopted in applications such as 5G smartphones, wearable devices, IoT, V2X, and LEO satellite communications.

    In response to advance packaging demands, LINCOTEC has expanded its technology portfolio to Fan-Out Panel Level Packaging (FOPLP) and IC substrate applications, enabling high-density panel-level RDL and fine-line dry etching processes to support high-performance, high-reliability, and scalable manufacturing in the moving towards fine line interconnection technologies.

    Main Products and Services

    (1)Sputtering Technology and Equipments: Low Rc. Excellent uniformity and peeling strength performance .High throughput.
    (2)Plasma Etching Technology and Equipments: Our technology can etch according to the characteristics of different materials to create fine line Space( L/S:5/5 m ) and micro via(10 m indiameter )features; including surface cleaning, surface modification, descum, desmear, via formation, thin down, etc..
    (3)Advanced Heat Dissipation Substrate Applications and Technical Capabilities: enables the production of precise metallized circuits on various substrate materials, including Alumina, Aluminum nitride (AlN), and Silicon Carbide (SiC); meeting the design requirements for miniaturization and high integration of high-power components while delivering exceptional thermal conductivity, insulation, and reliability.
    (4)OEM, sampling and process testing services and technical capabilities.
    (5)Application include semiconductor advanced package, advanced material, compound semiconductor, next generation display, heat dissipation substrate, green energy application.

    Company Basic Information

    Company Name (Chinese)

    凌嘉科技股份有限公司

    Company Name

    LINCO TECHNOLOGY CO., LTD.

    Chairman

    陳連春

    Chairman

    Leon Chen

    Capital

    NT$833,000,000

    Capital

    NT$833,000,000

    Contact Phone

    +886-4-2460-8771

    TEL

    +886-4-2460-8771

    Fax Number

    +886-4-2460-8779

    FAX

    +886-4-2460-8779

    Address

    台中市西屯區科園一路16號

    Address

    No.16,Keyuan 1st Road, Xitun Dist., Taichung City, Taiwan

    Company Website

    http://www.lincotech.com.tw

    Website

    http://www.lincotech.com.tw

    Contact Person

    李文馨

    Contact Person

    Clara Li

    E-mail

    clara.li@lincotec.com

    E-mail

    clara.li@lincotec.com

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