IC CHIP封裝模具精密加工解決方案 / IC Chip Packaging Mold Precision Machining Solution
▪︎針對半導體 IC 封裝模具、模仁及相關精密零組件，慶鴻提供涵蓋高速雕銑加工、放電加工與線切割加工的整合製程方案。依據工件結構與加工需求，透過高速雕銑完成基礎輪廓與結構加工，搭配線切割進行精密外形及細部輪廓加工，並運用放電加工完成多穴結構、複雜型腔與表面精加工。
放電加工可依需求形成均勻細緻的霧面類噴砂質感；在符合指定表面粗糙度與使用規範的條件下，加工完成後即可投入使用，減少或免除二次噴砂與拋光處理，有效縮短製程時間、降低人工及後加工成本，同時兼顧尺寸精度、表面一致性與封裝模具加工品質。
▪︎The packaging mold is the core component for molding IC chips (e.g., transfer/compression molding); the precision of its cavities, runners, and structures directly affects package appearance, dimensions, and yield. CHMER integrates milling, EDM, and wire-cut processes into one solution: milling forms the mold base and structure, deep-hole EDM machines runners and deep cavities, and wire-cut produces precise cavities and complex contours—achieving micron-level accuracy on high-hardness mold steel. After EDM, the mold surface carries a uniform matte, sandblasted texture that serves directly as the molding surface—ready for use straight off the machine with no additional polishing or surface treatment—effectively reducing demolding resistance and burrs. Combined with CHMER's rigid platforms and the W5N intelligent control system, the solution delivers high-precision, high-efficiency, automated machining that shortens development time and improves mold quality and lifespan.
