▪︎半導體光電:SEMI E187、晶錠切片、晶圓研磨與拋光、擴散、微影、薄膜、乾式與濕式蝕刻、濕製程(濕式清洗與蝕刻)、熱處理、量測與檢測、晶圓傳送、電路探針測試、OEM關鍵零組件、自動化與智慧製造ESG
▪︎Semiconductor / Optoelectronics: SEMI E187, Ingot Slicing, Wafer Grinding & Polishing, Diffusion, Lithography, Thin Film, Etch (Dry & Wet), Wet Process (Wet Clean and Etch), Metrology & Inspection, Wafer Handling, Circuit Probing (Test), Key Components for OEMs, Smart Manufacturing & ESG



