TEEIA

Solutions for rapid thinning and leveling of 2nd and 3rd generation semiconductor wafers

Grintimate Precision Industry Co., Ltd

Grintimate is specialized in offering high-precision grinding machines, standard equipped with our own advanced hydrostatic bearing technologies.

Integrates advanced technologies and strict attitude into our own products. We set ourselves very high standards and always keep up with constant know-how exchanges and innovations. These not only enhance our own technology but also strengthen our faith and passion the machine tool industry. With support from world-class suppliers, making a concerted effort to offer the best GRINTIMATE grinding machines & customized services to our customers.


Solution Details

Solutions for rapid thinning and leveling of 2nd and 3rd generation semiconductor wafers

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Solutions for rapid thinning and leveling of 2nd and 3rd generation semiconductor wafers

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▲GRINTIMATE - TIMTOS Factory Live工廠直播

GTR-1215 is equipped with the core technology of a hydrostatic spindle and rotary table made by Grintimate, which has the advantages of high rigidity and high precision. It is especially suitable for compound semiconductors or reclaimed wafer grinding. It is also easy to operate, fully functional, and cost-effective. It adopts manual loading mode, equipped with an automatic thickness measurement system and automatic compensation system, which can automatically grind to the target size accurately. With a hydrostatic spindle and a worktable, GTR-1215 can meet the processing applications of 4"-12" diversified products.


  • Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
  • Chuck table could be customized according to the needs of different sizes wafers.
  • Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
  • Achieve 300mm Si wafer thinning thickness <30µm, TTV <2µm, Ra 0.01µm


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