TEEIA

E&R Engineering Corp. HQ locate at Yenchao, Taiwan, providing high-tech, high-end, high-class quality automation machines which focus on Semiconductor industry, LED, Passive component, Material, Medical industry since 1994. In the past 20 years, we have supply world leading brand customers and build up great partnerships with great services and quality products, successfully develop different projects and leading the market, creating value to all our customers. "We deliver the best!", E&R commit to provider superlative quality machines to all the customers worldwide, support our partner to reach the next generation achievement.

Founded in 2019 as a subsidiary company under Foxconn/ Foxsemicon Technology Group, Kainova believes in flexibility, adaptability, and meeting customers' needs efficiently. Kainova welcomes challenges and values profession. With 20+ years of experience and our parent companies’ production capacity, we aspire to provide advanced equipment, introduce engineering solutions and build innovative business models for semiconductor industry.

SHIBA Precision was established in 2012 and was acquired by Feedback Technology in 2023, becoming a wholly owned subsidiary of the Xiangming Group. SHIBA Precision inherits more than 30 years of hard and brittle material processing expertise from its original Japanese parent company, providing semiconductor etching and advanced packaging customers with high-quality and cost-competitive products such as electrodes, focus rings, and more.

Jumbo Laser is part of the Syntec Group, which is composed of Syntec, Jumbo Laser, and Leantec, providing comprehensive capabilities that span CNC controllers, laser equipment, robotic arms, and full-factory automation integration. Leveraging the combined strengths of the group, we deliver one-stop solutions that integrate laser processing equipment + laser process technology + automation integration for the semiconductor and electronics manufacturing industries, supporting clean-process implementation, smart manufacturing adoption, production capacity enhancement, and strengthened traceability management. Jumbo Laser specializes in the R&D and manufacturing of advanced laser processing equipment, offering complete micro-precision laser processing technologies for semiconductor, FPC, and PCB manufacturing. To meet industry demands for precision processing, high yield, clean production, and traceability, we provide specialized laser systems including laser marking, laser scribing, and laser drilling for FPC and PCB applications—enhancing process stability, accuracy, and product consistency. We also offer wafer-related technologies such as wafer regeneration laser de-coating, wafer laser cutting, and wafer laser marking to support semiconductor-grade requirements featuring high precision, low chipping, high cleanliness, and high reliability, thereby improving material utilization and production efficiency. Amid global supply chain restructuring, localized manufacturing, clean production, and the rise of smart factories, we support enterprises with rapid technical assistance, flexible customization, and highly reliable equipment to drive production line upgrades and strengthen competitiveness. We strive to be a long-term technology partner in process optimization and automation transformation. We will continue working with customers, supply chain partners, and the broader industrial ecosystem to advance manufacturing upgrades and sustainable development, delivering higher precision, greater efficiency, and more valuable smart manufacturing outcomes for the semiconductor and electronics industries.

Scientech Corp., founded in October 1979, is one of Taiwan’s most established and experienced suppliers in the semiconductor industry. The company offers a comprehensive range of products, including semiconductor equipment, metrology systems, spare parts, consumables, robots, and anti-vibration platforms, and has recently expanded into heterogeneous integration and advanced packaging—playing a significant role in the AI supply chain. Since establishing its Hsinchu Hukou factory in 2003, Scientech has evolved from an equipment distributor into a developer and manufacturer of wet-process tools and TBDB temporary bonding/debonding systems, supplying major semiconductor fabs and advanced packaging customers worldwide. In 2006, the company expanded its 12-inch wafer reclaim facility, reaching a monthly capacity of 220,000 wafers, with further growth planned. This reflects Scientech’s ongoing commitment to innovation and technical excellence. Listed on the stock exchange in March 2013, Scientech has built a strong reputation across Taiwan, China, Korea, Southeast Asia, the U.S., and Europe through its diverse product portfolio and responsive after-sales service. Its three business units—equipment manufacturing, wafer reclaim services, and product distribution—are certified with multiple international standards, including ISO9001, ISO27001, ISO14001, ISO45001, ISO22301, and ISO50001. Focused on customer satisfaction and long-term sustainability, Scientech upholds the principle “Wherever our customers are, Scientech is there.” With offices in Silicon Valley, Europe, and Singapore, the company will continue to expand globally to enhance service quality and speed.