TEEIA

Aerotech, Inc. is a leading global manufacturer of high-performance motion control and precision automation systems. Founded in 1970 and headquartered in Pittsburgh, Pennsylvania, Aerotech designs and builds advanced positioning stages, motion controllers, servo drives, laser scan heads, and fully integrated automation platforms. Our products are widely used in semiconductor, photonics, laser processing, precision metrology, medical device manufacturing, aerospace, and research applications. With deep engineering expertise and industry-leading technology, Aerotech delivers sub-micron and nanometer-level precision, enabling customers to achieve higher accuracy, improved throughput, and superior process results. Known for reliability, innovation, and strong customization capabilities, Aerotech provides comprehensive engineering support and tailored solutions to customers worldwide.

Founded in 2013, Taiwan Electron Microscope Instrument Corporation (TEMIC) is the only one electron microscope vendor in Taiwan. In 2017, it won the capital injection from Hermes-Epitek, the pioneer of semiconductor equipment tech services. In 2018, it officially entered the Hsinchu Science Park, established the R&D Pilot Production and Exhibition Service Center, started a new wave of company reengineering, and officially transformed the target market to industrial customers, focusing on solving the special analysis problems request by the industry.

In June 2004, RI-FU Seiko was established as a joint venture between Japan’s PHOENIX Seiko and a Taiwanese corporation. The company specializes in precision engineering plastic components, complete equipment coating, and piping engineering services. In 2019, the EFC Group – Higashino Seiki acquired Nihon Fuku Seiko, implementing a full ERP operational environment and establishing integrated services across the group.

Htc Group specializes in providing advanced vacuum technology solutions tailored to the semiconductor industry, focusing on resolving particle issues and optimizing exhaust gas systems to boost production yields. Through innovation, we undertake wafer manufacturing challenges, helping our customers achieve their energy efficiency and carbon reduction goals.

We've accumulated semiconductor domains coverage among technology, design and applications. experienced technical consulting or solutions in DX (digital transformation), DfM (design-for-manufacturing) & MfD (manufacturing-for-design) deep-dive. we have various semiconductor foundry/chiplets supplychain resources (tsmc, Samsung, SKhynix, Keyfoundry, Winbond and ASE, Winfoundry, AWSC, etc)

High Energy E-Beam Tech., specialize in electron beam welding technology and combined with our machining capabilities. Together with our customers, we are committed to providing innovative solutions for various challenges in the Semi-Conductor Industry. With years of experiences in semi-conductors field, HEEBT aim to provide the highest quality precision welding to all customers.

Advantech is a global leader in IoT intelligent systems and embedded platforms, guided by its corporate vision of being an “Enabler of an Intelligent Planet.” In response to the growing trends of edge computing and artificial intelligence, Advantech has adopted a sector-driven strategy to accelerate deployment worldwide. With Edge Computing and Edge AI as its core, the company focuses on five key markets: edge intelligence systems, smart manufacturing, energy and utilities, smart healthcare, and smart retail and services. This approach strengthens Advantech’s global presence and enhances its core competitiveness. Advantech integrates its Edge Computing hardware platforms with the WISE-IoT industrial IoT software platform, adding industry-specific Edge AI solutions and domain expertise to establish a collaborative business model for integrated industry applications. This empowers partners and customers to connect across the industrial value chain. In addition, Advantech actively collaborates with ecosystem partners to co-create industrial ecosystems, accelerating the realization of industrial intelligence.

Company Profiles I. Background Kinik Company is a specialized grinding wheel manufacturer and operating over seventy years, which located in the famous place of ceramics and pottery in Taiwan - Yingge. Now we are the leading edge no matter in the technology, production scale, variety of the products, and customer services in this field. The leadership of our company comes from the advantages on our outstanding quality of service and integral infrastructure of the market channels. Our grinding wheels and cutting tools span across the low-end categories to the high-end application to meet any requirement of our customers on grinding and cutting. The products with various specifications we can provide now are more than one hundred thousand, and the number of the various customers we serve now has already over eight thousand. At present stage, we are devoting in transiting into a high value-added company based on our advantages in grinding and cutting. The sustainable investment on the capital expenditure and on the training and education of the employees achieve us to reform our business organism and to extend our business into the diamond-related industries and the reclaimed wafer. Our insistence on technology development, application innovation and the product quality, in addition to the assistance of the government grant had turned us into a technology-leading company. Now by the benefit of our leading artificial diamond technology, our tooling products for high-end industries have successfully improved not only the durability and processing accuracy but also dramatically decrease the waste of global resources. It can be deservedly claimed as the "Green Diamond". II. Major Business Items: The production, processing, and distribution of the all kinds abrasives (Grinding wheel, grindstone, emery cloth, abrasive paper and abrasives). The production, processing, and distribution of the cutting tools (Polycrystalline diamond, Tungsten Carbide saw blade). Polishing and Processing Service (3D polishing, ultra-high precision surface polishing, Column, Via hole, special-shape polishing, grinding processing, Polycrystalline diamond coating, and tungsten carbide cutting tools). The agency and sales of the raw material, equipments of the above items. CA02090 Metal line Products Manufacturing CA02990 Other Fabricated Metal Products Manufacturing Not Elsewhere Classified CA03010 Metal Heat Treating CA04010 Metal Surface Treating CQ01010 Die Manufacturing CB01010 Machinery and Equipment Manufacturing CC01080 Electronic Parts and Components Manufacturing C901010 Pottery and Ceramics Products Manufacturing C901020 Glass and glass made products manufacturing CE01030 Photographic and Optical Equipment Manufacturing A101020 Food Crops A102020 Agricultural Products Preparations C901070 Stone Products Manufacturing All business items that are not prohibited or restricted by law, except those that are subject to special approval. The Status of the Research and Development I. The Strategies of the R&D Exercising the most effective resilient approach to build technology and mass production, based on the grinding, in order to solve problems and create the leading edge. II. The objectives of the RD Become a world-class grinding technology development center. Establish a service platform for intelligent manufacturing and solutions. Create new across-field industrial chains and ecosystems. Extend product life cycle through process improvement and technology upgrade. Expand and supplement technology spectrum and basic research. Establish mass production technology for next-generation products. Strengthen the application and protection mechanisms of intellectual property rights to protect profits. III. The major RD items Advanced CMP diamond disks for the 2nm semiconductor manufacturing process. Reclaimed wafers of 19nm specifications. Processing for third generation semiconductor materials. High-number silicon based semiconductor grinding wheels. Third generation semiconductor grinding wheels. Ultra high-number precision grinding bar. IV. The achievements of the R&D Kinik Company has devoted a lot of resources in the R&D of the diamond-coated tools these years. Since diamond coated tools are hot only the necessities for the industries but also indispensable cutting tool for precision processing. The demand of these products amount reflect the industrialized mature status of a country. Although the fabrication and application of the diamond coated tools have been over a hundred year, but there are still two critical problems can't be solved. One is the low adhesive ability of diamond particles and the other is the uneven distribution of the diamond particles in the matrix. The loss of the diamond particles from the tools will shorten the lifetime of the tools and lower the machining efficiency. The brazing technology of the Kinik Company can secure the diamond particles firmly without dropping to extend the lifetime of these tools. And the series DiaGrid® products with regular arrangement of the diamond particles can greatly promote the efficiency of the processing. Meanwhile, the innovative DiaGridR CMP Pad Conditioner has become the necessity for the semiconductor manufacturers; furthermore, it has replaced the same type advance products produced by USA and Japan. And the ILB (Inner Lead Bonding) diamond bonding tool extended from the diamond brazing technology is also a crucial tool in the IC package industry. Besides, based on our more than 70 years accumulated core technology which established on material science, diamond grinding wheel, precision processing and diamond coating. The achievements of the Green Diamond products: DiaGrid ® CMP Pad Conditioner(Diamond Disk) Diamond Tool for PCB industry Diamond Tool for rocking industry MINI DIAMOND WIRE(Brazing diamond wire-saw and cutting for the ceramics and rocks.) MICRO DIAMOND WIRE(Diamond wire-saw and cutting for the hard and brittle materials.) Diamond FCCL electrodes The molds and consumables for the opto-electric industries. The tooling and consumables for the semiconductor package industries. CVD Diamond Polishing Tape. Diamond Bonding Tool. Successfully Developed Technologies or Products in the Most Recent Year: CMP diamond disk for 3nm semiconductor process. Reclaimed wafers of 26nm specifications. High-number thinning wheels for silicon wafers. Application technology of grinding wheel reclaiming. Reclaimed wafers from non-silicon-based hard and brittle materials. Business philosophy - Good together Good to you: Keep improving and upgrading quality to meet the needs of customers in grinding work. Good to me: Focus on shareholders' rights and benefits, employees’ welfare, and emphasize humanization and rational management to achieve harmonious and sustainable operation for all employees. Good to all: Promote management performance, give back to the society, and fulfill Corporate Social Responsibility (CSR). Mission Strive for Excellence to Create Innovative Value for the Industry and Customers. Vision To Become an Excellent Green Intelligent Manufacturing and Service Center for Grinding Solutions.

K-MAX offers semiconductor-related consumables key parts, and custom fabrication services, with expertise in ESC repair/manufacturing, high-precision ceramic and silicon/quartz/graphite components, and metal machining for Ion Implantation and etching processes.