志聖工業股份有限公司
C SUN Mfg. Ltd., established in 1966 and publicly listed on the Taiwan Stock Exchange in 2001 (2467.TT), has built its core business around heat and UV applications, specializing in essential process technologies such as thermal processing, UV curing, lamination, pressing and bonding, peeling, baking, and pre-treatment for electroplating. By integrating the resources of the G2C+ Alliance, C SUN delivers comprehensive and high-precision equipment solutions across a wide range of industries, including advanced semiconductor packaging, IC substrates, printed circuit boards (PCB), flat panel displays (FPD), electronic components, and footwear manufacturing.
C SUN is committed to its core business, advancing technical capabilities while expanding its global footprint. Our mission is to continuously innovate and tackle the most complex challenges in advanced processes such as 3D stacking, heterogeneous integration, circuit miniaturization, and wafer thinning. We provide outstanding, carbon-conscious smart automation solutions and have earned the trust of world-class customers across the globe. Together, we co-create value and strive to become a global leader in process equipment manufacturing.