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Company Description

Introduce
Perfect Precision Service Co., Ltd. (PPS), established in October 2019, was founded by a group of professionals with backgrounds in semiconductor-related component manufacturing, dedicated to the pursuit of precision machining technology. The team focuses on providing integrated services in technology, design, and materials, delivering high-precision, high-efficiency, and stable-quality manufacturing services to clients.

In metal processing, PPS possesses extensive experience and skilled personnel in CNC milling and turning for precision component machining.

For non-metal processing, PPS is highly proficient in machining hard materials such as sapphire, ceramics, and silicon carbide (SiC). Unlike conventional metal processing manufacturers, PPS prioritizes research into material properties and can provide recommendations on substrate selection based on the customer’s product usage environment and application.

In terms of quality, the company strictly implements quality and warehouse management systems.

The team is particularly focused on the semiconductor industry, combining process experience and close cooperation with fabs to continuously develop and improve spare parts. With a commitment to helping clients rapidly enter the market, PPS strives to achieve win-win outcomes.
By offering integrated technical services, PPS effectively enhances product yield and reduces the hidden costs of sourcing manufacturing partners.

Main Products and Services

Semiconductor electrostatic chuck maintenance and development

1. Analysis of common faults of electrostatic chuck

Insufficient adsorption
Cause: Wear on the suction cup surface, aging of the electrode, surface contamination or unstable electrostatic voltage.
Impact: The wafer or workpiece may slide or fall due to unstable adsorption, affecting process safety.
Static electricity failure/ Ceramic layer and static electricity generating layer rupture
Cause: Internal circuit damage, electrode short circuit, uneven voltage or electrostatic controller failure.
Impact: The electrostatic adsorption function cannot operate normally, causing the wafer to deviate during handling.
The ceramic surface is uneven and needs to be regenerated
Mechanical structure damage
Cause: The suction cup structural components are deformed or broken due to frequent operation or external force damage.
Impact: The suction cup positioning accuracy decreases, affecting wafer processing and detection accuracy.
Surface contamination and degradation
Cause: Dust, chemical residue, or particles attracted by static electricity accumulated after long-term use.
Impact: Reduced adsorption performance and increased risk of workpiece contamination.

2. ESC design in with customer process demand

Company Basic Information

Company Name (Chinese)

博飛特精密股份有限公司

Company Name

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