TEEIA

水平真空電漿乾式蝕刻設備 - PISCES Family

凌嘉科技股份有限公司

凌嘉科技是一家成立於1999年的公司,擁有來自半導體、IC封裝、光電等領域的專業技術團隊,專注於核心技術和製程設備的開發,以及散熱模組的研發。

Solution Details

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終端產品:

先進封裝/載板/印刷電路板/晶圓/扇出型晶圓級封裝/扇出型面板級封裝


設備應用:

  1. 產品表面電漿清潔與表面改質(親水或疏水性)
  2. 打線,UF, 模壓前基板清潔
  3. 微孔除膠渣(Desmear)
  4. 去殘膠(Desum)
  5. 光阻剝除(PR stripping)
  6. 介電材料減薄(例如Black matrix, 光阻, ABF)
  7. 金屬或介電材料蝕刻
  8. 通盲孔及盲孔底清潔
  9. 增加層間黏合度。


產品特色

  1. 具有高濃度自由基的高電漿體密度源(HDP),可實現高產能與高蝕刻速率
  2. 高密度電漿 (HDP) 和射頻 CCP-RIE 複合式彈性的製程能力.
  3. CFD 優化的噴淋頭設計,實現均勻的氣流傳導.
  4. 無縫接軌的製程參數操作,提供寬廣域的化學成分調適
  5. 製程腔體溫度控制,減少不想要氣體的凝結與副產品積累積於腔壁
  6. 良好抽氣系統設計,提高蝕刻均勻性和製程再現性。.
  7. APC 自動壓力閥門模組。
  8. 系統集成和監控的回讀信號的電漿源模組, 搭配 OES 終點檢測器, 製程即時監測與汙染物監控
  9. Pedestal溫度監測機制
  10. 配置無油式真空泵。 電源,真空和水流量安全互鎖。
  11. ESD 靜電防護。
  12. 符合SEGS-GEM規範的人機介面


產品規格

蝕刻非均勻性: <10%,依產品製程而定。

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