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2, 3代半導體晶圓快速減薄及整平的解決方案

全鑫精密工業股份有限公司

Grintimate全鑫專注於液靜壓產品的運用開發,提升台灣磨床品質,除了專精於傳統磨床,更涉足於半導體減薄設備,製造高精度、高效率生產的液靜壓磨床,結合先進的設計理念、研發技術與嚴謹的組裝流程,快速適應不斷變化的生產形態,將客戶的生產現場提升至新的高度。在高品質與高精度的要求下,全鑫在原有的敦實基礎上積極創新、推進技術,不僅在磨床領域建立新的標竿,快速反應市場需求,亦聯手全球優質的零配件供應商,持續為客戶提供高端的產品與客製化的服務。

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2, 3代半導體晶圓快速減薄及整平的解決方案

GTR系列搭載全鑫核心技術的液靜壓主軸及轉盤,具備高剛性及高精度等優點,特別適合應用在第三代半導體或再生晶圓研磨,易操作、功能齊全、高性價比的研磨設備,採用手動裝片模式,配置自動厚度量測系統、自動補償系統,可自動研磨至目標尺寸精度。本機台配置單主軸、單工作台,可滿足4"-12"的多元化產品加工應用。


  • 研磨同時監測磨削負載, 防止工件磨削過程中因壓力過大產生變形及破損。
  • 吸盤大小可根據客戶的需求定製, 滿足不同尺寸半導體材料的研削薄化工藝。
  • 晶圓厚度實時監測, 自動補正, 保證晶圓厚度的準確性。
  • 實現300mm矽晶圓減薄厚度<30µm、TTV<2µm, Ra 0.01µm。


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