TEEIA

雷射微細加工解決方案

惠特科技股份有限公司

惠特科技成立於2004年,為專業光電/半導體/雷射自動化設備研發與系統整合設備商。以FitTech自有品牌行銷全球,為目前全球LED測試與分選設備的最大供應商暨領導品牌,更以光電專業投入雷射二極體 (LD)及其他化合物半導體測試設備、雷射微細加工設備及自動化等設備整合研發。

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惠特雷射微細加工解決方案可提供應用於半導體、PCB等產業的雷射精密加工設備,提供如切割、鑽孔、劃線、刻印、清潔等應用。


針對陶瓷、矽等材料可提供切割、劃線及鑽孔設備。針對PCB產業,可提供應用於FPCB, BT, ABF板之鑽孔及切割設備。而在刻印部分,則可提供Si、SiC、GaAs、GaN等晶圓刻印設備、Strip刻印設備、Tray刻印設備等。


此外,雷射清潔設備亦是惠特的重點產品之一,相較於傳統清潔方式,透過雷射清潔可在不傷害基材的狀況下進行清潔,可提供包含手持式、機台式及整合協作型機械手臂之設備,針對不同產品進行清潔。


更多雷射清潔資訊歡迎至 https://zh-tw.fittech.com.tw/what-is-laser-cleaning 

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