TEEIA 台灣電子製造設備工業同業公會

SCREEN Semiconductor Solutions Co., Ltd. is a leading Japanese manufacturer specializing in semiconductor wafer equipment. The company maintains service locations in Japan, Korea, Taiwan, the United States, Europe, mainland China, and Singapore. Its product lineup includes equipment for cleaning, etching, and coating/developing processes, with its cleaning equipment holding the world's No. 1 market share. In recent years, SCREEN has consistently ranked among the top six global semiconductor wafer equipment suppliers in terms of sales. As the semiconductor industry continues to evolve rapidly, SCREEN remains dedicated to technological innovation and the development of next-generation equipment, making outstanding contributions to the advancement of the global semiconductor industry. SCREEN SPE Taiwan Co., Ltd. (Taiwan Deans Semiconductor Technology Co., Ltd.) was established in Hsinchu, Taiwan, in 1990. The company currently operates service centers in Linkou, Taichung, Tainan, and Kaohsiung. Committed to professional expertise and a customer-first approach, SCREEN SPE Taiwan provides comprehensive services, including the introduction of advanced semiconductor process equipment, technical support for equipment maintenance, and sales of spare parts and consumables. With 24/7 year-round support, the company aligns closely with its customers' development needs, earning their high trust and recognition and becoming a strategic partner for all-around collaboration. Looking ahead, SCREEN SPE Taiwan will continue to uphold the corporate philosophy of its parent company, fulfill its corporate social responsibility, and work hand in hand with customers to achieve sustainable business milestones.

TMH has estabilished a total solution for semiconductor manufacturing,and provides customer with solutions to the various issues facing the supply chains. Our international EC-site LAYLA with over 300,000 items, expanded into Japan in 2022. While strengthening the supply chain through ‘procurement,’ ‘logistics,’ and ‘manufacturing,’we are supporting the revival of Japanese manufacturing.

teeia

東祈企業股份有限公司

For 30 years since its establishment, EP Group has been providing professional services to world-class advanced enterprises, and has long been deeply involved in the fields of advanced materials and precision equipment with world-class manufacturers on both sides of the Taiwan Strait.

迪思科高科技股份有限公司

緯瑩企業有限公司

可成應材科技有限公司

馗鼎奈米科技股份有限公司

中國砂輪企業股份有限公司

Company Profiles I. Background Kinik Company is a specialized grinding wheel manufacturer and operating over seventy years, which located in the famous place of ceramics and pottery in Taiwan - Yingge. Now we are the leading edge no matter in the technology, production scale, variety of the products, and customer services in this field. The leadership of our company comes from the advantages on our outstanding quality of service and integral infrastructure of the market channels. Our grinding wheels and cutting tools span across the low-end categories to the high-end application to meet any requirement of our customers on grinding and cutting. The products with various specifications we can provide now are more than one hundred thousand, and the number of the various customers we serve now has already over eight thousand. At present stage, we are devoting in transiting into a high value-added company based on our advantages in grinding and cutting. The sustainable investment on the capital expenditure and on the training and education of the employees achieve us to reform our business organism and to extend our business into the diamond-related industries and the reclaimed wafer. Our insistence on technology development, application innovation and the product quality, in addition to the assistance of the government grant had turned us into a technology-leading company. Now by the benefit of our leading artificial diamond technology, our tooling products for high-end industries have successfully improved not only the durability and processing accuracy but also dramatically decrease the waste of global resources. It can be deservedly claimed as the "Green Diamond". II. Major Business Items: The production, processing, and distribution of the all kinds abrasives (Grinding wheel, grindstone, emery cloth, abrasive paper and abrasives). The production, processing, and distribution of the cutting tools (Polycrystalline diamond, Tungsten Carbide saw blade). Polishing and Processing Service (3D polishing, ultra-high precision surface polishing, Column, Via hole, special-shape polishing, grinding processing, Polycrystalline diamond coating, and tungsten carbide cutting tools). The agency and sales of the raw material, equipments of the above items. CA02090 Metal line Products Manufacturing CA02990 Other Fabricated Metal Products Manufacturing Not Elsewhere Classified CA03010 Metal Heat Treating CA04010 Metal Surface Treating CQ01010 Die Manufacturing CB01010 Machinery and Equipment Manufacturing CC01080 Electronic Parts and Components Manufacturing C901010 Pottery and Ceramics Products Manufacturing C901020 Glass and glass made products manufacturing CE01030 Photographic and Optical Equipment Manufacturing A101020 Food Crops A102020 Agricultural Products Preparations C901070 Stone Products Manufacturing All business items that are not prohibited or restricted by law, except those that are subject to special approval. The Status of the Research and Development I. The Strategies of the R&D Exercising the most effective resilient approach to build technology and mass production, based on the grinding, in order to solve problems and create the leading edge. II. The objectives of the RD Become a world-class grinding technology development center. Establish a service platform for intelligent manufacturing and solutions. Create new across-field industrial chains and ecosystems. Extend product life cycle through process improvement and technology upgrade. Expand and supplement technology spectrum and basic research. Establish mass production technology for next-generation products. Strengthen the application and protection mechanisms of intellectual property rights to protect profits. III. The major RD items Advanced CMP diamond disks for the 2nm semiconductor manufacturing process. Reclaimed wafers of 19nm specifications. Processing for third generation semiconductor materials. High-number silicon based semiconductor grinding wheels. Third generation semiconductor grinding wheels. Ultra high-number precision grinding bar. IV. The achievements of the R&D Kinik Company has devoted a lot of resources in the R&D of the diamond-coated tools these years. Since diamond coated tools are hot only the necessities for the industries but also indispensable cutting tool for precision processing. The demand of these products amount reflect the industrialized mature status of a country. Although the fabrication and application of the diamond coated tools have been over a hundred year, but there are still two critical problems can't be solved. One is the low adhesive ability of diamond particles and the other is the uneven distribution of the diamond particles in the matrix. The loss of the diamond particles from the tools will shorten the lifetime of the tools and lower the machining efficiency. The brazing technology of the Kinik Company can secure the diamond particles firmly without dropping to extend the lifetime of these tools. And the series DiaGrid® products with regular arrangement of the diamond particles can greatly promote the efficiency of the processing. Meanwhile, the innovative DiaGridR CMP Pad Conditioner has become the necessity for the semiconductor manufacturers; furthermore, it has replaced the same type advance products produced by USA and Japan. And the ILB (Inner Lead Bonding) diamond bonding tool extended from the diamond brazing technology is also a crucial tool in the IC package industry. Besides, based on our more than 70 years accumulated core technology which established on material science, diamond grinding wheel, precision processing and diamond coating. The achievements of the Green Diamond products: DiaGrid ® CMP Pad Conditioner(Diamond Disk) Diamond Tool for PCB industry Diamond Tool for rocking industry MINI DIAMOND WIRE(Brazing diamond wire-saw and cutting for the ceramics and rocks.) MICRO DIAMOND WIRE(Diamond wire-saw and cutting for the hard and brittle materials.) Diamond FCCL electrodes The molds and consumables for the opto-electric industries. The tooling and consumables for the semiconductor package industries. CVD Diamond Polishing Tape. Diamond Bonding Tool. Successfully Developed Technologies or Products in the Most Recent Year: CMP diamond disk for 3nm semiconductor process. Reclaimed wafers of 26nm specifications. High-number thinning wheels for silicon wafers. Application technology of grinding wheel reclaiming. Reclaimed wafers from non-silicon-based hard and brittle materials. Business philosophy - Good together Good to you: Keep improving and upgrading quality to meet the needs of customers in grinding work. Good to me: Focus on shareholders' rights and benefits, employees’ welfare, and emphasize humanization and rational management to achieve harmonious and sustainable operation for all employees. Good to all: Promote management performance, give back to the society, and fulfill Corporate Social Responsibility (CSR). Mission Strive for Excellence to Create Innovative Value for the Industry and Customers. Vision To Become an Excellent Green Intelligent Manufacturing and Service Center for Grinding Solutions.

TEEIA

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