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  • Company Basic Information

  • Company Description

    Company Profiles

    I. Background
    Kinik Company is a specialized grinding wheel manufacturer and operating over seventy years, which located in the famous place of ceramics and pottery in Taiwan - Yingge. Now we are the leading edge no matter in the technology, production scale, variety of the products, and customer services in this field. The leadership of our company comes from the advantages on our outstanding quality of service and integral infrastructure of the market channels. Our grinding wheels and cutting tools span across the low-end categories to the high-end application to meet any requirement of our customers on grinding and cutting. The products with various specifications we can provide now are more than one hundred thousand, and the number of the various customers we serve now has already over eight thousand. At present stage, we are devoting in transiting into a high value-added company based on our advantages in grinding and cutting. The sustainable investment on the capital expenditure and on the training and education of the employees achieve us to reform our business organism and to extend our business into the diamond-related industries and the reclaimed wafer. Our insistence on technology development, application innovation and the product quality, in addition to the assistance of the government grant had turned us into a technology-leading company. Now by the benefit of our leading artificial diamond technology, our tooling products for high-end industries have successfully improved not only the durability and processing accuracy but also dramatically decrease the waste of global resources. It can be deservedly claimed as the "Green Diamond".

    II. Major Business Items:
    The production, processing, and distribution of the all kinds abrasives (Grinding wheel, grindstone, emery cloth, abrasive paper and abrasives).
    The production, processing, and distribution of the cutting tools (Polycrystalline diamond, Tungsten Carbide saw blade).
    Polishing and Processing Service (3D polishing, ultra-high precision surface polishing, Column, Via hole, special-shape polishing, grinding processing, Polycrystalline diamond coating, and tungsten carbide cutting tools).
    The agency and sales of the raw material, equipments of the above items.
    CA02090 Metal line Products Manufacturing
    CA02990 Other Fabricated Metal Products Manufacturing Not Elsewhere Classified
    CA03010 Metal Heat Treating
    CA04010 Metal Surface Treating
    CQ01010 Die Manufacturing
    CB01010 Machinery and Equipment Manufacturing
    CC01080 Electronic Parts and Components Manufacturing
    C901010 Pottery and Ceramics Products Manufacturing
    C901020 Glass and glass made products manufacturing
    CE01030 Photographic and Optical Equipment Manufacturing
    A101020 Food Crops
    A102020 Agricultural Products Preparations
    C901070 Stone Products Manufacturing

    All business items that are not prohibited or restricted by law, except those that are subject to special approval.

    The Status of the Research and Development
    I. The Strategies of the R&D
    Exercising the most effective resilient approach to build technology and mass production, based on the grinding, in order to solve problems and create the leading edge.

    II. The objectives of the RD
    Become a world-class grinding technology development center.
    Establish a service platform for intelligent manufacturing and solutions.
    Create new across-field industrial chains and ecosystems.
    Extend product life cycle through process improvement and technology upgrade.
    Expand and supplement technology spectrum and basic research.
    Establish mass production technology for next-generation products.
    Strengthen the application and protection mechanisms of intellectual property rights to protect profits.

    III. The major RD items
    Advanced CMP diamond disks for the 2nm semiconductor manufacturing process.
    Reclaimed wafers of 19nm specifications.
    Processing for third generation semiconductor materials.
    High-number silicon based semiconductor grinding wheels.
    Third generation semiconductor grinding wheels.
    Ultra high-number precision grinding bar.

    IV. The achievements of the R&D
    Kinik Company has devoted a lot of resources in the R&D of the diamond-coated tools these years. Since diamond coated tools are hot only the necessities for the industries but also indispensable cutting tool for precision processing. The demand of these products amount reflect the industrialized mature status of a country. Although the fabrication and application of the diamond coated tools have been over a hundred year, but there are still two critical problems can't be solved. One is the low adhesive ability of diamond particles and the other is the uneven distribution of the diamond particles in the matrix. The loss of the diamond particles from the tools will shorten the lifetime of the tools and lower the machining efficiency.

    The brazing technology of the Kinik Company can secure the diamond particles firmly without dropping to extend the lifetime of these tools. And the series DiaGrid® products with regular arrangement of the diamond particles can greatly promote the efficiency of the processing. Meanwhile, the innovative DiaGridR CMP Pad Conditioner has become the necessity for the semiconductor manufacturers; furthermore, it has replaced the same type advance products produced by USA and Japan. And the ILB (Inner Lead Bonding) diamond bonding tool extended from the diamond brazing technology is also a crucial tool in the IC package industry.

    Besides, based on our more than 70 years accumulated core technology which established on material science, diamond grinding wheel, precision processing and diamond coating.

    The achievements of the Green Diamond products:
    DiaGrid ® CMP Pad Conditioner(Diamond Disk)
    Diamond Tool for PCB industry
    Diamond Tool for rocking industry
    MINI DIAMOND WIRE(Brazing diamond wire-saw and cutting for the ceramics and rocks.)
    MICRO DIAMOND WIRE(Diamond wire-saw and cutting for the hard and brittle materials.)
    Diamond FCCL electrodes
    The molds and consumables for the opto-electric industries.
    The tooling and consumables for the semiconductor package industries.
    CVD Diamond Polishing Tape.
    Diamond Bonding Tool.
    Successfully Developed Technologies or Products in the Most Recent Year:

    CMP diamond disk for 3nm semiconductor process.
    Reclaimed wafers of 26nm specifications.
    High-number thinning wheels for silicon wafers.
    Application technology of grinding wheel reclaiming.
    Reclaimed wafers from non-silicon-based hard and brittle materials.

    Business philosophy - Good together
    Good to you: Keep improving and upgrading quality to meet the needs of customers in grinding work.
    Good to me: Focus on shareholders' rights and benefits, employees’ welfare, and emphasize humanization and rational management to achieve harmonious and sustainable operation for all employees.
    Good to all: Promote management performance, give back to the society, and fulfill Corporate Social
    Responsibility (CSR).

    Mission
    Strive for Excellence to Create Innovative Value for the Industry and Customers.

    Vision
    To Become an Excellent Green Intelligent Manufacturing and Service Center for Grinding Solutions.

    Main Products and Services

    1. DiaGrid® CMP Pad Conditioner(Diamond Disk)
    2. Diamond Tool for PCB industry
    3. Reclaimed Silicon Wafer(6".8".12")
    4. Test and Prime wafers(6".8".12")
    5. Dicing Blade, For Semi-Conductor Industry
    6. Diamond Thinning Wheel
    7. The molds and consumables for the opto-electric
    8. The tooling and consumables for the semiconductor package industries.
    9. Diamond Bonding Tool
    10. Porous ceramic chuck table
    11. Dressing Board
    12. Backgrinding Wheels for Thinning Porces
    13. DIAMOND AND CBN Honey Comb Wheel

    中國砂輪企業股份有限公司

    中國砂輪KINIK COMPANY座落於台灣著名的陶瓷之鄉—鶯歌,是一家經營超過七十年以上的砂輪專業製造廠,舉凡生產規模、生產技術、產品的深度、廣度或是服務客戶家數等均為同業之冠。本公司掌握高服務品質及行銷通路架構完備之競爭優勢,在業界處於領導地位。從低階基礎至高階精密「研磨」、「切削」加工使用的砂輪或刀具等,均可全面供應,滿足客戶的需求。由目前提供國內產業使用之產品規格超過十萬種,服務的客戶超過八千家涵蓋各行各業可見一斑。近年來,有感於傳統產業轉型之需要,本公司本著長久以來所累積「研磨」及「切削」的製造利基,不斷投入設備及人力,從事衍生性鑽石製品的研發創新及進行企業改造,並跨足高科技晶圓再生產業。基於對技術創新、擴大應用的執著及產品品質的重視,並透過政府相關研發專案在技術及資金上的協助,使得中國砂輪得以跳脫傳統產業的宿命,躍升為高科技產業的一員。我們以高科技產業所使用的工具為標靶,使用人造鑽石(包括聚晶鑽石、鑽石薄膜、鑽石厚膜),開發出的製品,不但幫客戶提高工件的使用壽命與提昇加工品質,更減低了地球資源的耗用,因此我們很大聲地將之命名為──「 綠色鑽石」。


    主要產品與服務


    01.半導體CMP 製程拋光墊修整器( 鑽石碟)

    02. PCB 業用鑽石刀具

    03. 再生晶圓(6".8".12")

    04. 精密鑽石切割刀

    05. 鑽石減薄砂輪

    06. 光電產業用模具及耗材

    07. 半導體封裝用精密治夾具及耗材

    08. 鑽石壓焊錘

    09. 多孔質陶瓷真空吸盤

    10. 磨刀板

    11. 晶圓薄化砂輪


    Company Basic Information

    Company Name (Chinese)

    中國砂輪企業股份有限公司

    Company Name

    KINIK COMPANY

    Chairman

    林伯全

    Chairman

    Mr. Bob Lin

    Capital

    NT$1,469,410,800

    Capital

    NT$1,469,410,800

    Contact Phone

    +886-2-2679-1931

    TEL

    +886-2-2679-1931

    Fax Number

    +886-2-2679-7562

    FAX

    +886-2-2679-7562

    Address

    239010新北市鶯歌區中山路64 號

    Address

    No.64, Zhongshan Rd., Yingge Dist., New Taipei City 239010, Taiwan (R.O.C.)

    Company Website

    https://www.kinik.com.tw/zh-tw/

    Website

    https://www.kinik.com.tw/en-us/

    Contact Person

    蔡惠玲/李玟慧

    Contact Person

    239010新北市鶯歌區中山路64 號

    E-mail

    ir@kinik.com.tw

    E-mail

    ir@kinik.com.tw

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