HERMES-EPITEK CORP.

Hermes-Epitek was established in 1977, devoted in semiconductor manufacturing and Opto-Electronic process equipment, technical services and parts sales.

Through our “Service by Hermes-Epitek” philosophy, we have created a cohesive team that provides our clients with first-class products and services while generating an atmosphere of mutual trust between ourselves and our clients and suppliers. We not only bring the optimum overall equipment performance to clients, but also obtain the greatest market acceptance for suppliers’ equipment.

Main products and services

Services of Hermes-Epitek include semiconductor
manufacturing and Opto-Electronic process equipment,
technical services and parts sales, system OEM&spare parts
manufacturing and maintenance.
1. IC: Laser Mask Writer, Implanter, CMP System, Process
Metrology/Environmental monitoring Equipment, PVD,
Stepper&Laser Direct Imaging, ECD System, Ball Mount/
Reflow&Inspection Integrated System.
2. FPD: Mask Manufacturing & Photo Mask Repair, Laser
Repair.
3. LED: Coater/Developer, Plasma Etch System, MOCVD
Systems, Evaporator, Spray Coater.
4. Silicon, Quartz, Thermocouple, Gas Flow Valves, MFC and
IGS

企業基本資訊
  • Enterprise name

    HERMES-EPITEK CORP.

  • Chairman

    Archie Hwang

  • Tel

    +886-03-579-0022

  • Fax

    +886-03-579-0011

  • Address

    No.18 Creation Road 1, Hsinchu Science Park, Hsinchu,Taiwan, 300

  • Website

  • Industry category

    Semiconductor Equipment-CVD ‧ Semiconductor Equipment-ALD ‧ Semiconductor Equipment-ECD ‧ Semiconductor Equipment-Plasma Cleaning ‧ Semiconductor Equipment-PR Coater ‧ Semiconductor Equipment-Baker ‧ Semiconductor Equipment-Stepper Exposurer/Scanner Exposurer ‧ Semiconductor Equipment-Mask/Mask Aligner ‧ Semiconductor Equipment-Developer ‧ Semiconductor Equipment-Dry Etching ‧ Semiconductor Equipment-Dry Stripping ‧ Semiconductor Equipment-CMP ‧ Semiconductor Equipment-CMP Cleaning ‧ Semiconductor Equipment-Ion implantation ‧ Semiconductor Equipment-RTP ‧ Semiconductor Equipment-Oxidation & Diffusion furnaces ‧ Semiconductor Equipment-Wet Bench ‧ Semiconductor Equipment-Dry Mechine ‧ Semiconductor Equipment-Defect Measure ‧ Semiconductor Equipment-Probing Equipment ‧ Packaging/Testing Equipment-RDL CVD ‧ Packaging/Testing Equipment-Coater ‧ Packaging/Testing Equipment-Developer/Stripper ‧ Packaging/Testing Equipment-Oven/Curing Machine ‧ Packaging/Testing Equipment-RDL Exposure ‧ Packaging/Testing Equipment-RDL Dry Etching ‧ Packaging/Testing Equipment-CMP ‧ Packaging/Testing Equipment-Dispenser/Sealer/Molding ‧ Packaging/Testing Equipment-Dye Bonder ‧ Packaging/Testing Equipment-Wire Bonder ‧ Packaging/Testing Equipment-Wafer stacking equipment ‧ Packaging/Testing Equipment-Plasma Cleaning ‧ Display/Opto Equipment-Photo Resist Coater ‧ Display/Opto Equipment-Oven/Baker ‧ Display/Opto Equipment-Exposurer ‧ Display/Opto Equipment-Developer ‧ Display/Opto Equipment-Dry Etcher ‧ Display/Opto Equipment-Laser Remark ‧ LED/Micro LED-MOCVD ‧ LED/Micro LED-PECVD ‧ LED/Micro LED-Coater/Curing ‧ LED/Micro LED-Exposurer ‧ LED/Micro LED-Developer/Stripper ‧ LED/Micro LED-ICP Etch ‧ LED/Micro LED-RIE ‧ LED/Micro LED-E-Gun Vaper ‧ LED/Micro LED-Thermal Coater ‧ LED/Micro LED-RTA/Furnace ‧ LED/Micro LED-Dispenser/Sealer/Molding