TEEIA

微米級雷射解決方案

京碼股份有限公司

京碼提供微米級雷射解決方案,專精於雷射微蝕刻、微鑽孔、及微切割技術,為客戶設計客製精密雷射系統及機台,亦提供雷射精微加工處理服務。京碼之技術應用於各產業,製作關鍵零組件及配件,如: OEM各式光學尺, OEM生醫晶片線路成型, OEM電子束半導體檢測設備及電子顯微鏡所需之微孔鉬片。


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近期,京碼推出兩款雷射機台,
第一為超快深紫外 DUV 雷射機台,其特點為大功率、短脈衝,能執行多項製程,處理多種材料,如晶圓雷射開窗搭配電漿垂直切割、Micro-Led 剝膠 lift-off、三明治多層材料之半切、高分子材料之微鑽孔。DUV 雷射為冷加工,能將熱效應降到最低,不損傷材料,進行微鑽孔不會產生火山口,不會讓材料碎裂。
第二為水刀雷射機台,可切割硬脆材料,包含各類型化合物半導體,如碳化矽、氮化鎵,亦能切割鑽石及藍寶石。京碼亦能從原料開始,結合機加工及雷射加工程序,製造各類型光學編碼器量尺,包含:圓盤尺、直線尺、及碟片尺,以獨家專利微蝕刻技術,刻畫精密標線,以達成精準量測及運動控制,廣泛運用於工具機、機器人等。

相關法規認證:ISO 9001: 2015

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